HI.CAP

金属化聚丙烯薄膜电容器 METALLIZED POLYPROPYLENE FILM CAPACITOR

We’ve taken the science behind Audio performance very seriously, Only launching new products when we are able to contribute tangible benefits.
Taking inspiration from the highly regarded PB range, the HI.CAP employs the same carefully researched micro-phonics reducing processing parameters.
Connection of capacitor electrodes to the leads has always relied on thermal arc spray of tin-zinc, which results in hundreds of thousands of oxidized grain boundaries introducing;
HI.CAP Copper Connect technology dramatically reduces grain boundary crossings in the end connection, The philosophy of eliminating as many crystal boundaries as possible is extended to the use of premium grade 1.0mm2 tinned oxygen free copper leads.

HIGHLIGHTS
●Copper Connect 铜链接
●Featuring terminal leads made from PC-OCC copper
(oxygen free)无氧铜
●High quality Aluminum Metallized Polypropylene

TECHNICAL INFORMATION
●Non-polarized capacitor 无极性
●Non inductive construction 结构无感
●Excellent self-healing property 自愈
●Wrapped with polyester adhesive tape
●Ends filled with flame retardant epoxy resin
●Voltage rating: 400VDC
●Capacitance tolerance : +/- 3% 5% 10% centered on nominal value
●Temperature range: -30℃ to +85℃
●Extremely low ESR and ESL
●Dissipation factor: ≤ 0.1%
●Insulation Resistance：≥30000 MΩ (25℃ )

RATINGS AND DIMENSIONS: UNIT: millimeter